Sources Sought Notice for CHIPS High-Throughput High-Resolution X-ray Laminography/Tomography System for Advanced Packaged Semiconductors

The National Institute of Standards and Technology (NIST) is conducting market research to identify potential sources for a high-throughput, high-resolution X-ray laminography/tomography system to support advanced semiconductor metrology research. This system will be utilized by the NIST CHIPS Metrology program, which collaborates with the U.S. semiconductor manufacturing ecosystem—working with device manufacturers, tool vendors, material suppliers, and other organizations to address pivotal metrology challenges.

NIST researchers require a non-destructive 3D X-ray imaging solution capable of supporting critical research areas such as advanced metrology for future microelectronics manufacturing, integration of components in advanced packaging, and standardization of materials, processes, and equipment for microelectronics. Specifically, the system must be able to resolve 1 µm metal or non-metal line and space patterns at a minimum scan speed of 0.5 mm³ per minute in laminography mode. Systems offering greater resolution or scan speeds are of additional interest to the government. This sources sought notice is intended to gather information from manufacturers capable of supplying such equipment.