Silicon Nitride Supply for High Temperature Sensor Packaging
Overview
Fit Score
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SUMMARY
DESCRIPTION
NASA/NSSC requires silicon nitride to be used in sensor packaging designed for high temperature applications. This procurement is intended to be fulfilled through a sole source contract awarded to Sienna Technologies, Inc., identified as the only provider capable of supplying the required silicon nitride for these specialized sensor packages.
The work will be conducted at NASA's Glenn Research Center (GRC), with the acquisition of commercial items and services following FAR Part 12 and 13 procedures. Interested organizations may submit their capabilities and qualifications in writing to be considered for potential competition, though the determination to proceed with a sole source contract remains at the government's discretion. The submission deadline for capability statements is 4:00 p.m. Central Standard Time on February 25, 2026.
Source attribution
This Settle analysis is based on the issuing organization’s public RFP listing.