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Electrical Performance Monitoring System for Semiconductor Reliability Research

Overview


Medical Equipment & Lab Supplies
Gaithersburg, Maryland, United StatesPosted 27 days agoDeadline: April 24th, 2026

Fit Score


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SUMMARY


RFI for a system to monitor electrical performance and provide time-resolved data for advanced semiconductor packaging reliability research.

KEY REQUIREMENTS


BUDGET

Estimate

$50,000 – $150,000

TIMELINE


Response date: April 24th, 2026

Delivery: No later than 20 weeks after receipt of order.

QUESTION DEADLINE


April 19th, 2026

Issuing Agency


National Institute Of Standards And Technology

Organization overview and procurement intelligence available on paid plans.

DESCRIPTION


The client is seeking information regarding an electrical performance monitoring system to support time–resolved data generation for populating an open-source physical property database. This system is a critical component of a CHIPS project that centers on the reliability of advanced packaging in heterogeneously integrated semiconductor devices.

Requirements for the solution include support for multiuser software environments, EIS (Electrochemical Impedance Spectroscopy) testing and fitting capabilities, as well as the preferred ability to integrate external data loggers and temperature monitoring systems, with support for incorporating integrated file data. The solution will underpin research and reliability assessment activities for advanced semiconductor device packaging.

Source attribution

This Settle analysis is based on the issuing organization’s public RFP listing.

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